Modular Placement Machine
NPM-GW
NPM-GW
Main Features
- Support large components and large PCBs to meet the increasing demand for Electric Vehicles (EV) and DX
- 5M* process control “APC-5M” for good production and stable operation
* 5M: The variable elements of a production site: huMan, Machine, Material, Method, and Measurement - Various skill-less and manpower-saving features including Auto Setting Feeder
Modular mounter with wide range of components/PCBs compatibility
The basic performance of this modular mounter has been improved by renewing the core units, such as the placement head and recognition camera. It now supports a wide range of components and various components supply configurations, and can also handle larger PCBs. It also supports various automation and manpower-saving functions, including the Auto Setting Feeder (ASF), which automates the components supply operation, to flexibly meet the requirements of each mounting site.
NPM-GW
Strengths and Features
Supported PCB size
Supply unit configuration
Configuration example
Component supply units
Problems this product contributes to
Support for a wide variety of components
It can support wide variety of components, from micro to large.
Support for a wide variety of PCBs
Wide range of PCB sizes allows flexible production for various industries.
Enhance skill-less and labor-saving
Reduce human-dependent work, which is one of the causes of loss and quality degradation, and reduce dependence on specific workers by making them skill-less.
Wide variety of components
High productivity placement for a wide range of components
Placement head (new design)
The head configuration can flexibly handle from 0201 parts to large and tall parts. It enables production with high productivity. Compared with the catalog tact (CPH), the ±25 μm case is approximately 23% better than our company conventional model※.
※Compared with our company conventional model NPM-W2 (±40 μm).
Support for large and heavy BGA placement
Support for large and heavy components placement
By using a nozzle that supports large and heavy components and performing a scanning operation according to the component size, the system can support the placement of large and heavy BGA, which is a trend in the server industry. The system detects 15,000 BGA ball recognition.
Automated DIMM connector placement
High load placement / Tall component placement
High load placement of 100N is able to eliminate pin floating, and tall component mounting up to 53mm (including PCB thickness) allows automated DIMM connector placement.
(※Please consult us for applicable components.)
Adaptable to various supply section layouts
Three types of supply section units
By combining three types of supply section units, you can select a variety of supply section layouts.
Wide variety of PCBs
Wide range of PCB types and industries
Supported PCB sizes
The number of PCB sizes supported has been expanded from previous models to accommodate a wider range of PCB types, satisfying the needs of customers in a number of industries.
Support for large PCBs
Support for large PCBs
When the transfer direction dimension (L) exceeds 760 mm, the supported PCB size can be expanded up to 1,050 mm. When equipped with a front/rear extension conveyor, it can be expanded up to 1,260 mm.
High quality placement
Unit condition monitoring~analysis to optimize maintenance
APC-5M (option)
To ontrol 5M variation autonomously, unit condition can be monitored, analyzed easily to ensure proper maintenance.
5M Unit conditions are monitored in real time to control variations autonomously, enabling predictive maintenance before conditions deteriorate and preventing errors due to lack of maintenance.
Not only showing the status of each equipment, but also the entire line can be displayed on the LPC (Line Process Controller) screen for line status monitoring, and the status of target units in the line can be broken down for time-series analysis. The status after maintenance can also be checked to determine if maintenance is appropriate.
※5M : huMan, Machine, Material, Method, Measurement
Variation control with inspection machine (AOI/SPI)
APC System (APC-FF/APC-MFB2)
Maintains mounting quality by controlling variation in solder printing and component placement in conjunction with the inspection machine.
APC-FF is our unique in-line process control system that feeds forward the mounting position correction amount to the mounting machine based on the solder position data measured by solder inspection to maintain mounting quality.
The APC-MFB2 maintains mounting quality by feeding back component position data measured by the inspection machine (AOI) to the mounting machine after component placement.
Prevents mounting defects due to component setting errors
LCR checker (built-in type)
Measuring electrical characteristics of components prevents mounting defects due to component mis-setting. Stable measurement is possible by holding the posture and position of the component with an adhesive material, and by pressing down on the component with a metal lever, highly accurate measurement is possible regardless of the nozzle used.
Skill-less and labor-saving
Automation of components supply operations
Auto Setting Feeder
Automated supply of 8 to 104 mm wide reels of paper and embossed tape. The loading unit can be used to automate not only new tape supply, but also the next tape supply.
Automatic setting reduces set-up time and skill, while automatic loading eliminates the work for splicing, realize skill-less work.
Error recovery work performed offsite location
Remote Operation
Error recovery operations can be done remotely and efficiently, preventing on-site operators from being late in noticing error signals and allowing on-site operators to concentrate on supplying components, thereby improving productivity and reducing manpower.
Main Specifications
| NPM-GW | |
|---|---|
| PCB dimensions (mm) | Single conveyor Batch mounting：L 50 mm × W 50 mm ～ L 760 mm × W 687 mm 2 position mounting：L 50 mm × W 50 mm ～ L 360 mm × W 687 mm Dual conveyor PC size PCB width 300 mm Dual transfer ( Batch )：L 50 mm × W 50 mm ～ L 760 mm × W 300 mm Dual transfer ( 2 position )： L 50 mm × W50 mm ～ L 360 mm × W 300 mm Dual conveyor M size PCB width 260 mm Dual transfer ( Batch ) ：L 50 mm × W 50 mm to L 760 mm × W 260 mm Dual transfer ( 2 position )： L 50 mm × W 50 mm to L 360 mm × W 260 mm Single transfer ( Batch )：L 50 mm × W 50 mm to L 760 mm × W 510 mm Single transfer ( 2 position )： L 50 mm × W 50 mm to L 360 mm × W 510 mm * Slide Mounting : 1,050 mm/1,260 mm |
| Placement Head max Speed | 52 000 cph (0.069 s / chip) |
| Placement Head Placement Accuracy (Cpk≧1) | ±25μm / chip |
| Component dimensions | 0201chip ～ L 120 × W 90 × T 40 / T 45 or L 150 × W 25 × T 40 / T 45 |
| Maximum number of components supply (Tape Width: 4 mm, 8 mm calculation) | 136 |
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