Modular Placement Machine NPM-DX
NPM-DX
Main Features
- Achieves high productivity while supporting a wide range of components
- Supports placement accuracy of ±15 μm in high-accuracy mode
- 5M* process control “APC-5M” for good production and stable operation
* 5M: The variable elements of a production site: huMan, Machine, Material, Method, and Measurement - Various skill-less and manpower-saving features including Auto Setting Feeder
Achieving High Productivity, High Quality and Manpower Saving
This is a modular mounter to achieve both high productivity and high precision. The machine configuration is 4 heads and 4 feeder carts, and achieves high productivity while allowing the placement of up to 136 different types of components. In addition, it supports a variety of automation and manpower saving functions, including the Auto Setting Feeder (ASF), which automates components feeding operations, to flexibly meet the demands of each mounting site.
NPM-DX
Strengths and Features
Supported PCB size
Configuration example
Component supply units
Problems this product contributes to
High quality placement
High quality and high-accuracy placement even when small components such as in the device industry.
Maximize O.E.E by minimizing various losses
Minimizing various losses at production sites, maximizes O.E.E (Overall Equipment Effectiveness), and improves productivity.
Enhance skill-less and labor-saving
Reducing human-dependent work, which is one of the causes of loss and quality degradation, and reducing dependence on specific workers by making them skill-less.
High quality placemen
Maintains quality by controlling the placement load of die components
Load checker V2 (Option)
As the number of die components increases, the management of placement load becomes more important.
This function automatically measures the "indentation load" of the placement head on a regular basis, visualizes the nozzle sliding condition, and maintains performance and stable operation through predictive maintenance. (possible to measure even a low load of 0.5 N as well ).
Maximize O.E.E by minimizing various losses
Unit condition monitoring~analysis to optimize maintenance
APC-5M (option)
To ontrol 5M variation autonomously, unit condition can be monitored, analyzed easily to ensure proper maintenance.
5M Unit conditions are monitored in real time to control variations autonomously, enabling predictive maintenance before conditions deteriorate and preventing errors due to lack of maintenance.
Not only showing the status of each equipment, but also the entire line can be displayed on the LPC (Line Process Controller) screen for line status monitoring, and the status of target units in the line can be broken down for time-series analysis. The status after maintenance can also be checked to determine if maintenance is appropriate.
※5M : huMan, Machine, Material, Method, Measurement
Variation control with inspection machine (AOI/SPI)
APC System (APC-FF/APC-MFB2)
Maintains placement quality by controlling variation in solder printing and component placement in conjunction with the inspection machine.
APC-FF is our unique in-line process control system that feeds forward the mounting position correction amount to the mounter based on the solder position data measured by solder inspection to maintain placement quality.
The APC-MFB2 maintains mounting quality by feeding back component position data measured by the inspection machine (AOI) to the mounting machine after component placement.
Skill-less and labor-saving
Error recovery work performed offsite location
Remote Operation
Error recovery operations can be done remotely and efficiently, preventing on-site operators from being late in noticing error signals and allowing on-site operators to concentrate on supplying components, thereby improving productivity and reducing manpower.
Display AOI information on target machine screen when a quality error occurs
AOI information display
When a quality error occurs in AOI, quality error response can be performed skillless to improve operation rate. When a quality error occurs in AOI, information about the target device can be displayed in AOI, and AOI information including images can be displayed in the target device to respond skillless.
Main Specifications
| NPM-DX | |
|---|---|
| PCB dimensions (mm) | Single lane mode:L 50 mm × W50 mm ～ L 510 mm × W 590 mm Dual lane mode:L 50 mm × W50 mm ～ L 510 mm × W 300 mm |
| Placement Head max Speed | 49 000 cph(0.073 s / chip) 35 000 cph(0.103 s / chip) |
| Placement Head Placement Accuracy (Cpk≧1) | ±25μm / chip ±15μm / chip |
| Component dimensions | 0201 chip ～ L 120 × W 90 × T 30 or L 150 × W 25 × T 30 |
| Maximum number of components supply (Tape Width: 4 mm, 8 mm calculation) | 136 |
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