High Density Radial Lead Component Insertion Machine RG131/RG131-S
RG131/RG131-S
Main Features
- In addition to high-speed insertion of 0.25 s/ component, operation rate is improved by adopting sequential component supply system
- High-density insertion by the guide pin method and high-speed stable insertion by the component lead V-cut function are simultaneously realized
- Various operation modes are realized by the two-separate component supply unit (80-slot type only)
High density radial lead component insertion machine for high quality and high production with our company's unique insertion method
This high density radial lead component insertion machine achieves high productivity with our company's unique guide pin method and component supply section of sequence system.
RG131/RG131-S
Strengths and Features
Problems this product contributes to
High productivity
Achieves high-speed insertion at 0.25 s/component even for large components with 3 or 4 pitch specifications.
High-density insertion
Can be inserted into the gap where components can enter (0.5 mm gap between components) by the guide pin method.
Large-size PCB support
Large-size PCB support option allows hole recognition and insertion up to PCB size of Max.650 mm × 381 mm.
High productivity
High speed insertion
Adoption of the component supply unit sequence system enables high-speed insertion at 0.25 s/component for large components with 3 or 4 pitch specifications in addition to conventional standard components with 2 pitch specifications.
Highly efficient production
The 80-slot type specification employs the dual- partitioned component supply method. It enables to select the operation mode( connection,preparation and exchange mode) according to the production mode, from mass production to low-volume production of a wide variety of products.The operation rate and productivity have been improved by reducing machine downtime when out of components or changeover. (Figure is an example of the exchange mode)
High-density insertion
Guide pin method
The use of guide pins makes high-density insertion possible when there is a gap between components
( the gap between components is 0.5 mm ).
High-density insertion of large components
With 4 pitch specifications of 2.5 mm, 5.0 mm, 7.5 mm and 10.0 mm, realized high speed insertion from small components of 2.5 mm to large components of 10.0 mm and φ18 mm with 1 machine.
Stabilization of the insertion rate
By cutting the lead wire of the electronic component in a V-shape, it is easy to ride on the hole on the tip of the guide pin to stabilize the insertion rate.
Large-size PCB support
Large-size PCB support option
Large-size PCB support option allows hole recognition and insertion up to PCB size of Max.650 mm × 381 mm.
2 PCB transfer option
Two PCBs are carried into the XY table, and two PCBs are produced in one process.
2 PCB transfer option can decrease PCB loading time by half and increase productivity.
Main Specifications
| RG131/RG131-S | |
|---|---|
| PCB dimensions (mm) | L 50 x W 50 ~ L 508 x W 381 |
| Max Speed | 0.25 s/component to 0.6 s/component |
| No of components input | RG131：80 ( Connection mode ) , 40 + 40 ( Exchange mode ) RG131-S ：40 |
| Applicable components | Pitch 2.5 mm , 5.0 mm , 7.5 mm , 10.0 mm Height Hn=Max.26 mm Diameter D=Max.18 mm Resistor, Electrolytic capacitor, Ceramic capacitor, LED, Transistor, Filter, Resistor network |