Display-related Systems
Strengths of Panasonic display-related systems
High-quality and high-reliability mounting process solutions with the industry’s number-one track record
The FPD manufacturing process has a step of mounting a driver IC and FPC on a panel. This step requires a particularly high level of precision. Panasonic offers our time-tested high-quality and high-reliability mounting solutions and mass production systems that dependably manufacture conforming products.
Products
List by process and application
Display-related systems lineup by process and application
COG/FOG Dual-purpose Bonder
FPX305CG
Integrated IC/TCP supply unit supports 2 bonding modes (COG/FOG) for LCDs.
COG/FOP Dual-purpose Bonder
FPX007CG/FP
By changing component supply units, four different bonding (COG/FOG/FOP/COP) enabled.
COP/FOP Dual-purpose Bonder
FPX007CG/FP2
Equipped with advanced functions essential for flexible AMOLED production. The bonding quality and productivity cultivated through COG bonding for LCDs are also realized in COP/FOP bonding for OLEDs.
FOG/FOF Dual-purpose Bonder
FPX007FG/FF
Flexible support for FOF mounting on TCP with panel flipping unit. Increases production quality in combination with our mounting inspection machine
FPC Bonder
FPX105FG
Support wide range of FPC bonding from ones used for cellphones/smart phones to those for tablets or notebook PCs.
COG Bonder
FPX105CG
COG bonding technology we have been developing realizes further bonding quality and productivity improvement and an advanced COG bonder that is easier to use.
COG Bonder
FPX005CG
COG bonder supporting two sides bonding of panels up to sizes of 1-inch to 7-inch.
Impression Inspection Machine
FPX007AI
High-speed inspection of all pins of flexible OLED panels. High-speed tracking AF and MBR detection method optimized for plastic panels.
Features of Panasonic display-related systems
IC/TCP bonders
IC/TCP bonding is available by changing the component supply units.
Our original fixed-point mounting (temporary bonding) ensures high-precision mounting.
FPC bonders
Equipped with a universal tool for temporary bonding.
Highly adaptable to various shapes and sizes of FPCs
Impression inspection machines
High-speed, high-accuracy inspection of ACF bonding conditions of mounted components.
Capable of inspecting all mounted components and pins using a line scan camera
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