Dry Etcher [Solution]
Do you face any of these problems?
- Need to achieve high productivity
- Need to achieve increased brightness of LED
- Need to achieve high resolution processing of compounds
- Need to perform etching of non-volatile materials
List of dry etcher applicable applications
▲Examples of utilization and application of various materials
Panasonic dry etching solutions
| Classification | Single wafer/batch type dry etcher | Single wafer type dry etcher |
| Model |
APX300 |
APX300-S |
|---|---|---|
| Exterior | Housing multiple devices in one box increases the area productivity |
The E620 process chamber with extensive track record is bonded on the latest APX300 platform |
| Features |
|
|
| Target wafer | Multiple wafers Batch treatment (tray specification) |
Examples of applications in compound semiconductor
Examples of application in LED and optical communication devices
▲Case studies of application and processing of LED
Examples of applications in power device
Examples of applications in high-frequency communication devices
Examples of applications in MEMS and sensors
MEMS/Sensors
Processing of dielectric films, metals, and silicon used in gyroscopes, pressure sensors, printer heads, etc.
■Piezoelectric MEMS, PZT thick film etching (FS-ICP plasma source application)
W to W stability
PZT E/R ≧ 50 nm/min
Uniformity
In wafer ≦ ±5%
W to W ≦ ±1%
PR selectivity ≧ 0.7
Pt selectivity ≧ 8
■Non-volatile material etching (FS-ICP plasma source application)
NiFe/NiCo etching
E/R ~100nm/min.
Unif. ≦ ±5%
PR Sel. ≧ 0.6~1.5
No fence, No corrosion
Au etching
E/R ≧400nm/min.
Unif. ≦ ±5%
PR Sel. ≧ ~2.0
No fence
Pt etching
E/R ≧200nm/min.
Unif. ≦ ±5%
HM Sel. ≧ 10
No fence
Pt/SBT/Pt etching
E/R ≧140nm/min.
Unif. ≦ ±5%
0.4um L/S
No fence