Solutions
Electronic Component Mounting-related System
Solutions using electronic component mounting systems
We offer soulutions how Panasonic can help you solve your problem.
Support for various PCBs and production formats
As PCBs become more diverse, each industry demands a variety of component mounting needs, such as thin and large PCBs, and small component and high-density mounting.Panasonic offers solutions that support various PCBs, as well as solutions that achieve high quality and productivity.
Respond to High Quality Requirements
We will introduce various functions of our mounting and printing machines and various solutions that realize high-quality by combining them with software.
Respond to Parts Diversification
We provides customers with optimal solutions for their diverse parts mounting needs, including small, large, and odd-shaped parts.
Respond to Automation and Manpower Saving
Automation solutions for our printing and mounting machines. These solutions help reduce labor, improve stability, and improve productivity at production sites, thereby helping to solve problems at the sites.
Solutions for industries
We offer solutions tailored to industry trends.
Proposals for Module and Device Industry
We introduce total solutions including screen printing, mounting, and process controls to meet the demands of mounting technology, such as 0201 components and high density with spacing of 50 μm, which have been rising in line with electronic components becoming smaller and thinner.
Proposals for Smartphone Industry
We introduce reasons why our customers choose us, based on the aspects of high production, high accuracy, special process support, and automation/labor saving.
Proposals for Automotive Industry
We introduce the NPM-WX series for mounting large power components and sensors associated with the electrification of powertrains and small components associated with the expansion of communication modules.
Proposals for Server Industry
We explain solutions customized for various challenges faced when responding to the requirements for high-efficiency production of multiple models following the diversification of PCBs and components.
Support items for electronic component mounting systems
We propose support items for electronic component mounting systems that meet your needs.
Support items to improve productivity
We propose productivity improvement solutions for solder printers, mounting machines and mounting processes.
Support items to improve quality
We propose improvement solutions for solder defects, electronic component mounting defects and enhanced mounting reliability.
Support items to reduce cost
We propose improvement solutions for solder defects, electronic component mounting defects and enhanced mounting reliability.
Mounting software
We contribute to the maximization of OEE by managing Panasonic's electronic component mounting systems across the entire line and reflecting them in production planning.
Device-related System
Bonder
We propose high-accuracy multi-die bonding, continuous stacked bonding, and flip-chip bonding.
Dry etcher
We introduce examples of LED and power device applications, communication devices, MEMS and sensor applications.
Plasma dicer
We introduce problems with dicing using blades (grinding wheels) and advantages of plasma dicing.
Automation and Labor-saving
Automation and Manpower Saving Solutions
We propose high-quality production systems using “Panasonic’s process management techniques” and “collaboration through cooperative system integrator”.
Automation for mounting-related processes
Automation for assembly, testing, and packing processes