Plasma Dicer [Solution]

Do you face any of these problems?

  • Need to eliminate damage and chipping
  • Need to achieve high productivity by batch treatment with plasma
  • Need to suppress the occurrence of dust/particle that causes lower yields
  • Need to design chip shapes freely

Plasma dicer realizes high productivity by damage-less and clean dicing.

Advantages of plasma dicing/Propose the most suitable method for devices

Product lineup

  • Equipped with ultra-high density enhanced-ICP plasma source for high rate high-speed machining
  • Continuous machining of different materials in the same chamber (e.g., Si + insulating film※)

    • ※Applicable range may vary depending on processing conditions and material characteristics.
  • Equipped with a Dual-Enhanced plasma source to achieve excellent processing uniformity by controlling the distribution of high-density plasma
  • Utilizing in-situ wafer temperature measurement function to achieve damage-free high-speed processing by temperature control
  • Allows continuous processing of different materials in the same chamber (e.g., Si + insulating film※）

    ※Applicable range may vary depending on processing conditions and material characteristics.。
APX300-PDプロモーションビデオ（英）