Device-related Systems
Strengths of Panasonic device-related systems
Total support for customers from verification to mass production
We provide full support to our customers through the verification of each semiconductor manufacturing process at our verification center.
List by process
Semiconductor-related system lineup by process
List of Solutions
Updated Content
About Dry Etcher
Examples of LED and power devices, and communication devices and MEMS and sensors
About Plasma Dicer
Introduction for the challenges of dicing with blades and the advantages of plasma dicers
About Bonder
High-precision multi-die bonding, continuous stack bonding, and flip-chip bonding are proposed
Products
Dry etchers
APX300 is a batch-type dry etching machine capable of high-speed and high-precision processing.
A variety of processing technologies accumulated through mass-production contribute to the development and production of devices such as LEDs, SAW-F, and MEMS.
Plasma dicer
APX300-DM and APX300-PD are plasma dicing machine capable of high-speed and high-precision processing. Plasma dicing is uses a chemical reaction process with plasma, damage- and particle-free processing with a reduced dicing width improves processing quality and productivity.
Panasonic will propose solutions for plasma dicing including pre- and post-processing.
Plasma cleaners
The PSX307 series parallel plate plasma cleaners are designed for PCB cleaning and surface modification, and ready for automatic transfer. They improve the adhesion and bonding performance during the packaging process, ensuring the high quality required for communication and automotive devices.
Die bonders and flip-chip bonders
The MD-P series high-performance bonders contribute to the miniaturization and functionality enhancement of devices and modules.
Capable of high-quality mounting of various devices, improving the yield.
New
Flip-chip Bonder
MD-P300HS
New flip chip bonder bonder that improves semiconductor manufacturing productivity and realizes high-quality and high-precision mounting。
Die Bonder
MD-P200
Bonding device that is compatible with various bonding processes for state-of-the-art device assembly.
Flip-chip Bonder
MD-P300
Supports φ300 mm wafer supply. Realizes high-speed and high-accuracy flip-chip bonding applicable to COW bonding too.
Flip-chip Bonder
MD-P200US2
Specialized ultrasonic flip-chip machine. Uses proprietary US tool and achieves a consistent quality.
Related products
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